The TT-65 ThermoTweez provides safe, one-handed reflow and removal of 2-sided chip components, SIT’s, SOIC’s, SOJ’s and is the only Thermal Tweezer that can handle large PLCC’s, QFP’s and other four sided components. Unlike other methods, its high thermal capacity and targeted heat removes large SMDs in just seconds without damage to the board of the risk of adjacent components reflow even on heavy assemblies. The unique vertically orientated handpiece and a wide variety of quick-change, slim-line tips easily reach into the tightest spaces for fast, safe component removal. The TT-65 also features a patented stroke adjustment to reduce hand fatigue for repetitive operations. IntelliHeat and SensaTemp versions available. Kit includes TT-65 handpiece and Tip & Tool Stand with low abrasive dry wipe capability. Tips supplied separately.